Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Purpose The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly semiconductor chips package. Good adhesion properties (>5 MPa shear strength) low resistance (better than SAC solders) are goal research. Design/methodology/approach Mechanical TIM joints between gold plated contacts chip substrate were investigated. Sintering technique based on Ag pastes was applied study. Performance assessed by force tests measurements. Scanning electron microscopy used microstructural observations cross-section formed joints. Findings It concluded that best achieved containing spherical particles dozens micrometer size with flake shaped few micrometers size. temperature at 230°C 1 during sintering gave higher lowest resistance. Originality/value new material paste mixtures different (form nanometer microns) shape (spherical, flake) suspended resin proposed. Joints prepared using pressure shows better mechanical other such as grease, gel or thermally conductive adhesive. Those could enable electronic device operation temperatures above 200°C, currently unavailable Si-based power electronics.